Samsung begins mass production of HBM4 memory chips

February 12, 2026 (MLN): Samsung Electronics has started mass production of its next-generation HBM4 memory chips, a key component for powering large-scale artificial intelligence data centers.

The company described the chips as "industry-leading" and said commercial shipments to customers have already begun, APP reported.

The new high-bandwidth HBM4 chips are significantly faster than previous models, exceeding industry standards for processing speed by more than 40%, designed to meet the growing demand for higher-performance AI infrastructure.

US tech giant Nvidia is widely expected to be one of the main buyers.

The global rush to build AI data centers has driven surging demand for advanced memory chips.

Samsung and South Korean rival SK hynix have been racing to bring HBM4 to market, following Samsung’s previous lag in the HBM3 segment.

Earlier this year, Samsung posted record quarterly profits, fueled by strong memory chip sales, and the company has pledged billions of dollars to expand production and upgrade manufacturing processes.

With the South Korean government aiming to be a top-three AI power alongside the US and China, Samsung’s move could help cement the country’s leadership in AI technology.

The focus on AI chips could push up retail prices for consumer electronics, as major tech companies including Apple, Microsoft, and Amazon compete to secure high-performance memory.

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